SMT patch Tin solder paste

SMT (Surface-Mount Technology) patch tin solder paste is a type of solder used in the assembly of electronic components onto printed circuit boards (PCBs). It consists of a mixture of fine solder powder and flux, which helps to clean and prepare the metal surfaces for soldering. This paste is designed to work with surface-mount devices (SMDs) and is essential for achieving reliable and strong solder joints.

Key Features:

• Composition: Mixture of fine solder powder and flux
• Alloy Type: Typically Sn63/Pb37 (63% tin, 37% lead) or lead-free alternatives like Sn96.5/Ag3.0/Cu0.5 (96.5% tin, 3% silver, 0.5% copper)
• Particle Size: Typically in the range of Type 3 to Type 5 (25-45 microns)
• Flux Type: RMA (Rosin Mildly Activated), No-Clean, or Water-Soluble
• Melting Point: Depends on alloy type, e.g., 183°C for Sn63/Pb37
• Application Method: Stencil printing, dispensing, or pin transfer
• Viscosity: Optimized for stable application and minimal slump
• Storage Conditions: Refrigerated at 0°C to 10°C for optimal shelf life

Technical Specifications:

• Alloy Composition: Sn63/Pb37 or lead-free alternatives
• Flux Percentage: Typically 10-15% by weight
• Halide Content: Halide-free options available
• Residue: Low residue for no-clean types, water-soluble for easy cleaning
• Tackiness: Good tackiness to hold components in place during assembly
• Shelf Life: Typically 6 months to 1 year when stored properly

Applications:

• Surface-Mount Assembly: Used in the assembly of SMDs onto PCBs.
• Reflow Soldering: Suitable for reflow soldering processes in both convection and infrared reflow ovens.
• Prototyping: Ideal for prototype and small-scale production runs.
• Repair and Rework: Used for repairing and reworking SMT components on existing PCBs.