SMT patch Tin solder paste

SMT patch Tin solder paste

15,400.00

SMT (Surface-Mount Technology) patch tin solder paste is a type of solder used in the assembly of electronic components onto printed circuit boards (PCBs). It consists of a mixture of fine solder powder and flux, which helps to clean and prepare the metal surfaces for soldering. This paste is designed to work with surface-mount devices (SMDs) and is essential for achieving reliable and strong solder joints.

Key Features:

  • Composition: Mixture of fine solder powder and flux
  • Alloy Type: Typically Sn63/Pb37 (63% tin, 37% lead) or lead-free alternatives like Sn96.5/Ag3.0/Cu0.5 (96.5% tin, 3% silver, 0.5% copper)
  • Particle Size: Typically in the range of Type 3 to Type 5 (25-45 microns)
  • Flux Type: RMA (Rosin Mildly Activated), No-Clean, or Water-Soluble
  • Melting Point: Depends on alloy type, e.g., 183°C for Sn63/Pb37
  • Application Method: Stencil printing, dispensing, or pin transfer
  • Viscosity: Optimized for stable application and minimal slump
  • Storage Conditions: Refrigerated at 0°C to 10°C for optimal shelf life

Technical Specifications:

  • Alloy Composition: Sn63/Pb37 or lead-free alternatives
  • Flux Percentage: Typically 10-15% by weight
  • Halide Content: Halide-free options available
  • Residue: Low residue for no-clean types, water-soluble for easy cleaning
  • Tackiness: Good tackiness to hold components in place during assembly
  • Shelf Life: Typically 6 months to 1 year when stored properly

Applications:

  • Surface-Mount Assembly: Used in the assembly of SMDs onto PCBs.
  • Reflow Soldering: Suitable for reflow soldering processes in both convection and infrared reflow ovens.
  • Prototyping: Ideal for prototype and small-scale production runs.
  • Repair and Rework: Used for repairing and reworking SMT components on existing PCBs.

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SKU: 2489 Category:

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