SMT patch Tin solder paste
₦15,400.00
SMT (Surface-Mount Technology) patch tin solder paste is a type of solder used in the assembly of electronic components onto printed circuit boards (PCBs). It consists of a mixture of fine solder powder and flux, which helps to clean and prepare the metal surfaces for soldering. This paste is designed to work with surface-mount devices (SMDs) and is essential for achieving reliable and strong solder joints.
Key Features:
- Composition: Mixture of fine solder powder and flux
- Alloy Type: Typically Sn63/Pb37 (63% tin, 37% lead) or lead-free alternatives like Sn96.5/Ag3.0/Cu0.5 (96.5% tin, 3% silver, 0.5% copper)
- Particle Size: Typically in the range of Type 3 to Type 5 (25-45 microns)
- Flux Type: RMA (Rosin Mildly Activated), No-Clean, or Water-Soluble
- Melting Point: Depends on alloy type, e.g., 183°C for Sn63/Pb37
- Application Method: Stencil printing, dispensing, or pin transfer
- Viscosity: Optimized for stable application and minimal slump
- Storage Conditions: Refrigerated at 0°C to 10°C for optimal shelf life
Technical Specifications:
- Alloy Composition: Sn63/Pb37 or lead-free alternatives
- Flux Percentage: Typically 10-15% by weight
- Halide Content: Halide-free options available
- Residue: Low residue for no-clean types, water-soluble for easy cleaning
- Tackiness: Good tackiness to hold components in place during assembly
- Shelf Life: Typically 6 months to 1 year when stored properly
Applications:
- Surface-Mount Assembly: Used in the assembly of SMDs onto PCBs.
- Reflow Soldering: Suitable for reflow soldering processes in both convection and infrared reflow ovens.
- Prototyping: Ideal for prototype and small-scale production runs.
- Repair and Rework: Used for repairing and reworking SMT components on existing PCBs.
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