CPU Thermal paste

CPU Thermal Paste, also known as thermal compound or thermal grease, is a high-performance material used to enhance the thermal conductivity between a CPU (or GPU) and its heatsink. This paste ensures optimal heat transfer, preventing overheating and maintaining efficient cooling performance. It is essential for building and maintaining high-performance computing systems, gaming rigs, and workstations.

Key Features:

• High Thermal Conductivity: Ensures efficient heat transfer from the CPU to the heatsink.
• Low Thermal Resistance: Minimizes heat buildup, maintaining optimal CPU temperatures.
• Easy Application: Smooth and spreadable consistency for easy application.
• Non-Corrosive: Safe for all types of CPUs and heatsinks, preventing damage or corrosion.
• Long-lasting Performance: Maintains its thermal properties over extended periods.
• Non-Electrically Conductive: Prevents the risk of short-circuiting and electrical damage.

Technical Specifications:

• Thermal Conductivity: Typically 8-12 W/mK (varies by brand and type)
• Thermal Resistance: Low thermal resistance for efficient heat transfer
• Viscosity: Smooth and spreadable consistency
• Operating Temperature Range: -50°C to +200°C
• Volume: Commonly available in 1g, 3g, and 5g syringes or tubes
• Composition: Silicone-based or metal oxide-based compounds

Applications:

• CPU and GPU Installation: Essential for building and maintaining desktops, laptops, and gaming rigs.
• Overclocking: Provides improved thermal performance for overclocked systems.
• Heatsink and Cooler Installation: Enhances heat transfer for air and liquid cooling systems.
• Electronics Maintenance: Used in various electronic devices requiring efficient heat dissipation.