ESP-M2 ESP8285 module

ESP-M2 module core processor is the high-performance chip ESP8285, which is equal to ESP8266 chip plus 1M Flash.
The chip ESP825 is encapsulated an advanced Tensilica’s L106 32-bit CPU, together with SRAM. ESP825 has the full and complete WiFi function, which can be used independently and also used as a slave with other Hoster MCU, which can start directly from the out-built Flash. In addition, the built-in high-speed buffer is a benefit for the system performance. Especially, ESP8285 can be used as a WiFi adapter by SPI/SDIO and/or I2C/UART interface, when it is applied to the other MCU design.

Features:

Ultra-small size;
Support serial to WiFi;
Wireless transparent transmission;
Long distance transmission with ultra-low power;
Support outboard antenna;
Bearing high temperature to 125 ℃, compared to the 85℃ for ESP8266.

Technical Specifications:

SOC characteristics
Built-in Tensilica L106 ultra-low power 32-bit CPU, main frequency supports 80MHz and160MHz and RTOS;
Built-in TCP/IP protocol;
Built-in one-channel 10-bit high precision ADC;
Outboard interface: HSPI, UART, I2C, I2S, IR Remote Control, PWM, GPIO;
Deep sleep current is 10uA, the cut-off current is smaller than 5uA;
Wake, connect and transmission data package within 2ms;
The consumer power is smaller 1.0Mw (DTIM3) when at standby status;
Built-in 1M byte for SPI Flash.

WiFi characteristics
Support 802.11 b/g/n/e/I;
Support Station, Soft AP, Soft AP+STA mode;
Support WiFi Direct (P2P);
Support CCMP (CBC-MAC, computation mode), TKIP (MIC, RC4), WAPI (SMS4), WEP (RC4), CRC etc., for hardware acceleration.
P2P finding, P2P GO mode/ GC mode and P2P power manage
WPA/PA2PSK and WPS;
802.11securitycertification: pre-certification and TSN
Support 802.11n (2.4GHz);
802.1h/RFC1042 frame encapsulation;
Support seam less roaming;
Support AT remote update and cloud update (OTA);
Support Smart Config function (including Android and Ios device).

Module interface:

2* UART;
1*ADC;
1*En;
1*wakeup pin;
1*HSPI;
1*I2C;
1*I2S
More than 10*GPIOs
Working temperature: -40℃-+125℃;
Module size: 12.3*20mm

Applications:

Electrical appliance;
Smart power plug, smart light;
Infant monitor;
Sensor networks;
Security ID label;
Wireless location beacon;
Home automation;
Mesh networks;
IP video camera;
Wearable electronics;
Wireless location recognition;
Industrial wireless control;